
According to a 2021 study, 25-40% of fabric used in garment production is wasted. There are many reasons for this, including quality issues and overproduction, but 50% of total fabric loss happens during the cutting process. However, with the adoption of the right 3D technology, designers and manufacturers can reduce textile waste and fabric consumption throughout the design and production process.

Pattern nesting, also known as marker-making, is the process of arranging the pattern pieces efficiently, wasting as little fabric as possible and maximizing fabric yield. CLO researchers have been working behind the scenes to enhance our Print Layout tool for pattern nesting using advanced computational methods that prioritize marker efficiency and nesting speed.
Finding the best arrangement
Pairwise clustering algorithm is one of the main principles of accelerating nesting and increasing marker efficiency. It detects and combines neatly interlocking patterns and treats them as a compound pattern during nesting.

In a set of 30 nesting examples ranging from 15 to 100 pattern pieces, the new algorithm in CLO 2024 showed improved marker efficiency by 1-2% on average, compared to CLO 7.3.

Minimizing fabric length
Additionally, we combined efficient algorithms and advanced heuristics to optimize pattern placement while avoiding overlapping and respecting grainline orientation. Each automated nesting process surveys hundreds of different placement solutions to maximize consumption.


Accelerated nesting
As a result of these improvements, CLO’s nesting tool is 10x faster than before and can provide the best arrangement within seconds, significantly accelerating workflows and allowing users to measure consumption easily.
Pattern nesting is just one of many improvements that the CLO research team is working on to continuously improve our products and solutions. We will be sharing more exciting updates periodically – so please stay tuned for future developments!
Interested in joining the R+D team? Find our job postings HERE.

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